Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Mycronic Introduces Jet Dispensing Capability on MY600 Platform
November 9, 2015 | Mycronic ABEstimated reading time: 1 minute
Mycronic introduces new high-speed and high-precision jet dispensing capabilities on the MY600 platform at Productronica 2015 in Munich, 10-13 November. Mycronic has developed the technology on the existing MY600 platform.
Mycronic’s business area SMT (Surface Mount Technology) offers flexible production solutions for electronics manufacturing. The product offering includes production equipment for application of solder paste, robots for mounting electronic components on circuit boards (pick & place), automated storage solutions and software.
Now Mycronic is again expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. With new extended jet dispensing capabilities, the high-performance MY600 platform makes it possible for the electronics industry to improve productivity when dispensing a wide range of fluids. The technology is well suited for a variety of applications used in the semiconductor and SMT industry, such as semiconductor chip encapsulation, cavity fill and conductive adhesive dispensing.
Used as a jet dispenser, the MY600 achieves micrometer precision while delivering throughputs 2 to 10 times higher than those of traditional dispensers, depending on the application. These productivity gains are yet another example of Mycronic’s ability to give customers a leading technology edge within the electronics industry. The new jet dispensing capabilities are scheduled to be available first half of 2016.
About Mycronic AB
Mycronic AB is a Swedish high-tech company engaged in developing, manufacturing and marketing of production equipment to the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany Japan, Singapore, South Korea, Taiwan, the Netherlands, United Kingdom and the United States.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.