Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Uyemura USA Releases Thru-Cup MSC-PS Acid Cleaner
November 9, 2015 | UyemuraEstimated reading time: 1 minute
Uyemura USA announces the release of Thru-Cup MSC-PS Acid Cleaner, the group’s answer to enhanced cleaning and increased wetting of high aspect ratio plated through holes and micro-vias. The superior detergency, coupled with the low surface tension provides for excellent electroplated copper adhesion, and void free coverage.
Don Walsh, Director of Operations for Uyemura USA states "The Thru-Cup MSC-PS Acid Cleaner has shown superior performance out in the field, and has an exceptionally long bath life with customers reporting significant cost savings."
The Thru-Cup MSC-PS Acid Cleaner is designed as a drop in replacement process for conventional vertical copper electroplating applications. The Thru-Cup MSC-PS Acid Cleaner has minimal copper etching, and does not attack or damage dryfilm resists.
For more information about the Thru-Cup MSC-PS Acid Cleaner or any of Uyemura USA other products and services contact sales@uyemura.com.
About Uyemura USA
Uyemura USA is “powered by science, focused on customers” by providing exceptional, problem-solving final finish technology solutions, electroplating chemistries for through hole and via filling, insoluble anodes, and cleaners for the IC packaging, printed circuit board, general metal finishing, aerospace, and healthcare industries. Uyemura USA also has complementary state-of-the-art chemistries including MEC Company LTD, Umicore Galvanotechnik, and Europlasma. For more information visit www.uyemura.com.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.