-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Speeding up the Design Cycle: 10 Things to Remember
November 11, 2015 | Mark Thompson, CID, Prototron CircuitsEstimated reading time: 2 minutes

Many people understand the value of a PCB, but do not understand the best way to interact with PCB manufacturers. Poor planning and communication with fabricators slows down the design cycle and increases overall costs for your project.
In this column, I will attempt to help streamline the design cycle through fabrication. Following my tips will minimize the need for future revisions and ensure you get quality boards on time.
10. Eliminate Conflicting Information
It is essential that you eliminate any conflicting information from your drawings or read-me files. Make sure that all documentation is the same. If one document says half-ounce and another says one-ounce copper, you may expect a call asking which it is to be. If you need the part expedited, remember that this takes valuable time away from the build and from you getting your part.
9. Provide an IPC Netlist
An IPC netlist will allow the fabricator to check your design against your exported data. Make sure any known or intentional netlist mismatches are noted again so your CAM group does not waste time calling you to check on things you are already aware of.
Be careful with castellated pads where plated half-holes at the board’s edge will make a connection to a post at some point after fabrication. These typically come up as “broken” or open nets because when the bare boards are fabricated, no post exists to connect these castellations.
Known A-gnd to D-gnd shorts should also be noted. Make sure no non-plated holes have been specified as test points on the IPC netlist. If you are specifying net-compare on your documentation, be sure to include it!
8. Check for Discrepancies on NC Drill File
Double-check to ensure there are no discrepancies of count, size or plating status on the NC drill file. Either one of these can cause communication delays.
7. Communicate With Your Fabricator ASAP
In order to facilitate the best communication, you need to meet with your chosen fabricator as soon as possible in the design cycle. Check with them for validation of any impedance you may have. Make sure these notes do not conflict either.
Be sure to: Check for proper reference planes. Make sure impedance traces do not traverse multiple splits or lack ref-planes altogether. Differentiate between single-ended and differential type structures by a tenth or a hundredth of a mil. Again, fabricators cannot resolve these small increments, but this allows the fabricator to uniquely select just the impedance tracks for any resizing that may be necessary to meet desired impedances.
Make sure the space between differential pairs is consistent throughout the run. Allow for process deviation, setting up a part as .1 mm trace and space on half-ounce starting copper does not leave room for any trace resizing that may be necessary to meet the impedances if dielectric cannot be altered.
When calling out materials, call out the 4101/# such as 4101/126. This will allow the fabricator to use any material that falls within the /126 criteria. Calling out a specific material may limit the pool of fabricators that can build the board. Avoid creating same net spacing violations when terminating differential pairs, and do not “wrap” the differential pairs around the terminus.
To read this entire column, which appeared in the October 2015 issue of The PCB Design Magazine, click here.
Suggested Items
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.