-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
3D AOI System YSi-V from Yamaha IM Offers Performance, Affordability, Field-upgradable
November 16, 2015 | Yamaha Motor Intelligent MachineryEstimated reading time: 2 minutes
It makes perfect economic sense to buy only the AOI performance that you need today, especially if you can upgrade it in the field to meet tomorrow’s needs. That’s the thinking behind Yamaha Intelligent Machinery’s new economical AOI solution; the YSi-V 5M automated optical inspection system.
Yamaha Motor IM’s YSi-V 5M is equipped with industry-standard 5 Megapixel Cameras, getting the inspection job done for all current SMT devices while keeping the cost affordable. But the YSi-V 5M is also field upgradable, so that at a later date, if greater defect analysis is needed, the system can be upgraded to 3D and 4D capability. This enables customers to buy the technology they need today, while knowing that additional features can be added later if they are required. It’s a perfect solution for the PCB assembler with a limited budget who wants to “Future Proof” their investment.
In addition to standard 2D AOI functionality, the YSi-V Series machines can be configured for high speed 3D inspection as well. Furthermore, the YSi-V has 4D capability by employing 4 additional off-axis cameras along with its main downward looking camera. With 4D capability, components can be inspected at 5 different angles, increasing object visibility around nearby components. Moreover, all five images can be later recalled at a repair station for better defect analysis.
In making the announcement, George Babka, Sales General Manager for the SMT Business Group of Yamaha Motor IM America, Inc., said, “With the release of the 3D YSi-V 5M, we have set a new industry standard for AOI. The 5M System joins our YSi-V 12M (12 Megapixel) machine as another high-speed AOI system that can be configured for 2D, 3D and 4D; it’s a remarkable system combining flexibility, capability, and low cost of ownership.”
About Yamaha Motor Intelligent Machinery
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation, and has employed its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. Yamaha Motor IM offers a full line of machines for electric/electronic parts mounting and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.