-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
3D AOI System YSi-V from Yamaha IM Offers Performance, Affordability, Field-upgradable
November 16, 2015 | Yamaha Motor Intelligent MachineryEstimated reading time: 2 minutes

It makes perfect economic sense to buy only the AOI performance that you need today, especially if you can upgrade it in the field to meet tomorrow’s needs. That’s the thinking behind Yamaha Intelligent Machinery’s new economical AOI solution; the YSi-V 5M automated optical inspection system.
Yamaha Motor IM’s YSi-V 5M is equipped with industry-standard 5 Megapixel Cameras, getting the inspection job done for all current SMT devices while keeping the cost affordable. But the YSi-V 5M is also field upgradable, so that at a later date, if greater defect analysis is needed, the system can be upgraded to 3D and 4D capability. This enables customers to buy the technology they need today, while knowing that additional features can be added later if they are required. It’s a perfect solution for the PCB assembler with a limited budget who wants to “Future Proof” their investment.
In addition to standard 2D AOI functionality, the YSi-V Series machines can be configured for high speed 3D inspection as well. Furthermore, the YSi-V has 4D capability by employing 4 additional off-axis cameras along with its main downward looking camera. With 4D capability, components can be inspected at 5 different angles, increasing object visibility around nearby components. Moreover, all five images can be later recalled at a repair station for better defect analysis.
In making the announcement, George Babka, Sales General Manager for the SMT Business Group of Yamaha Motor IM America, Inc., said, “With the release of the 3D YSi-V 5M, we have set a new industry standard for AOI. The 5M System joins our YSi-V 12M (12 Megapixel) machine as another high-speed AOI system that can be configured for 2D, 3D and 4D; it’s a remarkable system combining flexibility, capability, and low cost of ownership.”
About Yamaha Motor Intelligent Machinery
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation, and has employed its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. Yamaha Motor IM offers a full line of machines for electric/electronic parts mounting and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.