-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha and The National Graphene Institute Sign Collaborative Partnership Agreement to Develop Graphene-Based Electronics Materials
November 20, 2015 | AlphaEstimated reading time: 3 minutes
Alpha, the world leader in the production of electronic bonding materials, today announced a collaborative partnership with the National Graphene Institute (NGI) at The University of Manchester to develop next generation Graphene-Based Electronic Materials for the Electronics Assembly & Packaging, as well as for the Energy and Power Market Segments.
The collaboration is a multi-year effort and focuses on how to utilize these innovative soldering materials in applications where components must meet higher connectivity, mobility and sustainability requirements. Graphene-based materials provide significant improvement in thermo-mechanical reliability that are particularly useful in the Energy and Power industries.
“Alpha is very excited and proud to be a part of this groundbreaking institution”, said Richard J. Ertmann, President of Alpha. “As a key contributor and collaborator, we look forward to the many innovative and new technologies and applications for Graphene in our products and marketplaces. Alpha is very thankful to The University of Manchester for this opportunity to work closely with their highly respected and creative scientists and technicians.”
NGI chose Alpha as a partner because of their long-term commitment to product development. “We look forward to working with Alpha on this exciting new project”, said James Baker, Graphene Business Director at The University of Manchester. “This collaboration and partnership is another significant step forward to realising the next generation of graphene-based electronic materials and Alpha are a welcome addition to our ever expanding partnerships with industry. Since the opening of the £61m National Graphene Institute we are now seeing a significant acceleration in engagement with industry and an increasing number of industry partners now working on graphene projects. With the Graphene Engineering Innovation Centre, which will be completed in 2017 also located in Manchester, the University of Manchester continues to play a leading role in the commercialisation of graphene”.
Dr. Bawa Singh, EVP for Technology and Corporate Development at Alpha commented, “Working with NGI at the University of Manchester, I believe affords us many exciting and unique opportunities to innovate and develop next generation materials. The synergies resulting from Alpha’s global presence as a leading supplier of Electronic Materials coupled with Manchester’s Technology prowess and the unrivalled equipment and facilities at NGI will enable us to make substantial contributions to next generation materials in Electronic Systems”.
The use of graphene-based technologies is expected to be used for broader applications across Alpha’s diverse product portfolio and affiliate companies.
Page 1 of 2
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.