It’s Only Common Sense: The Power of Storytelling in Sales
Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
Schmoll Introduces New MDI Product at productronica 2015
November 20, 2015 | Burkle North AmericaEstimated reading time: 1 minute
During the most recent Productronica show held in Munich, Germany, Schmoll Maschinen GmbH introduced the new Micromirror Digital Imaging System (MDI), a digital direct imaging system using Digital Micromirror Device (DMD) technology. This new technology transfers UV light images to the circuit board substrate using high resolution micromirror chips.
As a new technology, Schmoll brings to the industry a robust granite platform system ensuring image stability suitable for photoresist inner layer/outer layer and solder mask applications. Three systems are available including a single table system, a double table system for faster throughput and larger table surface for sizable panels. The system can be configured for one to as many as six heads for higher throughput.
The MDI-ST and the MDI-DT are assembled on a stable granite platform with a precision table based on Schmoll’s extensive experience in both mechanical and laser drilling systems. The MDI Light Engine provides 2 million individually adjustable micromirrors for fine line imaging resolution. In addtion, the compact design and flexibility of these systems allow for economical use of floor space.
As the largest manufacturer of productive drilling and routing systems in the world, Schmoll Maschinen GmbH offers an economical approach with their extensive system and imaging technology to the PCB industry.
Bürkle North America has been the exclusive Schmoll distribution (parts, sales and service) partner in North America for over 10 years.
Contact Dave Howard 714-379-5090 for more information, or access www.burkleamerica.com for all up-to-date information on Schmoll product lines.
About Burkle North America - Bürkle North America, Inc. is a wholly owned division of Robert Bürkle GmbH, of Freudenstadt, Germany. Bürkle is the leading manufacturer of productive manufacturing technologies serving a variety of manufacturing industries, including surfaces / woodworking technologies, photovoltaic module lamination and coating, printed wiring board fabrication and plastic card fabrication.
Schmoll Maschinen – Schmoll Maschinen is one of the leading suppliers of machine tool and mass production solutions for electronic and micro structuring applications with more than sixty years of engineering experience. Schmoll’s solution portfolio covers all performance relevant steps for mechanical and laser micro machining and is complemented by automation technology.
Share on:
Suggested Items
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.