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SolderStar Pushes Intelligent Manufacturing with SMARTLine
November 24, 2015 | SolderStar LtdEstimated reading time: 3 minutes
SolderStar SMARTLine communicates via IP networks providing data from the SMT line and provides tools for analysis of the captured data using web based methods via desktop or mobile platforms. These tools provide an immediate insight into the performance of the process, providing engineers with an invaluable insight into the manufacturing environment.
The system architecture uses a layered approach and is built upon existing and widely used protocols. As Industry 4.0 standards develop further it will be a simple step to integrate the data feeds into customer systems with built in support for a number of exchange formats such as XML, JSON and AMQP.
About SolderStar Ltd
UK based SolderStar Ltd is one of the world’s leaders in thermal management systems, with over a decade of specialising in the design, development and manufacture of thermal profiling equipment for the lead-free electronics industry, with nearly 2500 systems currently in use worldwide.
Incorporating state-of-the-art technology and full lead-free compliance, SolderStar’s range of instruments and software tools offers leading-edge performance, functionality, heat-resistance and miniaturisation.
SolderStar satisfies all of today’s thermal process control needs, from full-feature high performance product profiling for reflow, wave, vapour and selective solder processes, to fully integrated SPC capabilities for continuous quality and process control. Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world.
Page 2 of 2Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.