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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience

07/08/2026 | Micron
Micron Technology, Inc. and Ford Motor Company today announced a long-term Strategic Customer Agreement (SCA) to strengthen the supply of memory and storage solutions supporting Ford’s next-generation vehicle production.

Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030

07/07/2026 | Globe Newswire
The advanced packaging technologies market is experiencing significant growth, projected to expand from $8.03 billion in 2025 to $9.18 billion in 2026, at a CAGR of 14.2%.

Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

07/06/2026 | Global Electronics Association
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, California.

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

07/02/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

Somacis Completes Acquisition of Group ACB, Expanding European PCB Manufacturing Network

07/02/2026 | I-Connect007 Editorial Team
Somacis Group has completed its acquisition of Group ACB, a PCB manufacturer with operations in France and Belgium, further expanding the company's European manufacturing footprint and strengthening its capabilities in high-reliability PCB production.
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