BAE Systems Nets £1.3B Contract for Anson Submarine
November 24, 2015 | BAE SystemsEstimated reading time: 1 minute
The full contract covers the design and remaining build, test and commissioning activities on Anson, the fifth of seven technologically-advanced submarines in the class. Manufacturing commenced in 2010. Anson is now at an advanced stage of construction at our Barrow-in-Furness, Cumbria site and on schedule to leave for sea trials in 2020.
Tony Johns, Managing Director of BAE Systems Submarines, said: "Signing this contract is an important milestone in the Astute programme.
"This is a hugely complex national endeavour and we are proud of the role we play in helping to protect our nation's interests.
"HMS Astute and HMS Ambush are already demonstrating their world-class capabilities with the Royal Navy, whilst the third submarine in the class, Artful, is continuing with her sea trials. The build phase for the fourth, Audacious, is also well advanced, so we continue to make positive progress across the programme."
The contract was announced by Philip Dunne MP, Minister of State for Defence Procurement, during a visit to our Company today.
He said: “This £1.3 billion contract marks an important step in the progress of the Astute programme. This is a key part of our £166 billion plan to ensure that our armed forces have the equipment they need to defend the UK’s interests across the seas, in the skies and on land, both at home and abroad.”
“This new contract for Anson not only provides significant financial savings of £50 million to the taxpayer but also secures thousands of jobs in Barrow and across the UK supply chain, demonstrating the Government’s commitment to increase defence spending each year for the rest of the decade.”
We employ more than 7,600 people in our Submarines business, including those working on the Astute programme. Boat six Agamemnon and the yet-to-be named seventh are also under construction in Barrow.
Astute class submarines mark a step change in defence capability. Powered by a nuclear-reactor, each of the submarines will provide land strike, strategic intelligence-gathering, anti-submarine and surface ship warfare capabilities.
We are also leading the design phase on the programme to replace the current fleet of Vanguard submarines, which carry the UK's strategic national deterrent.
In readiness for the start of construction on this programme, our site is undergoing significant redevelopment with new facilities to be built alongside the refurbishment of others.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
Qualcomm, Snap Expand Strategic Collaboration
04/13/2026 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. and Specs Inc., a Snap subsidiary, announced a multi-year strategic agreement to power future generations of Specs with Qualcomm Technologies’ industry-leading Snapdragon system-on-a-chip (SoC).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in