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Remtec to Participate in EMS Industry Fly-In: Where Policy Meets the Production Line in Washington, D.C.

09/18/2026 | Remtec
President and CEO of Remtec, Brian Buyea Will Join The Industry Leaders in Advocating for a Stronger, More Resilient U.S. Electronics Manufacturing Base

GlobalFoundries, Marvell Expand Collaboration for Next-generation Optical Connectivity

09/18/2026 | GlobalFoundries
GlobalFoundries (GF) and Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced an expanded multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont, facility to support growing demand for next-generation optical connectivity.

FSQuality Circuits to Showcase Advanced PCB Manufacturing Capabilities at PCB West 2026

09/18/2026 | FSQuality Circuits
FSQuality Circuits (FQC), a leading Thailand-based manufacturer of advanced printed circuit boards, will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California.

Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

Advanced Packaging and the New Scaling Walls

09/17/2026 | Chetan Arvind Patil, Marvell Technology
Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.
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