Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Koh Young Holds Annual Americas Sales Meeting; Technica USA Named Representative of the Year
November 26, 2015 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the market leader in solder paste inspection and automated optical inspection systems, held its annual Koh Young Americas National Sales Meeting in October. More than 30 of the top manufacturer’s representatives in the Americas joined the sales training and products workshops with team-building sessions. Juan Arango, Americas Sales Director, stated, “Our goal is to help educate our sales channel partners to become better informed and aware of every benefit that our 3D inspection technologies offer. This enables them to provide even greater value and solutions to our customers. It keeps them best-equipped to support our customer base in delivering the value of true 3D inspection.”
Koh Young also named Technica USA ‘Sales Representative of the Year’. Technica covers Northern California (Bay area) and the Greater Pacific Northwest (WA, OR, WY, MT, UT, CO, ID). “Technica has done a great job in promoting the Koh Young inspection message and supporting our customer needs through their relationships and their San Jose Demo and Training Center,” noted Allen Phung, Americas Sales Manager.
Both Jason Perry, Director of Sales and Elliott Le, Bay Area Account Manager at Technica were present and accepted the award on behalf of Team Technica. Jason Perry further commented, “It has been a great partnership and our success over the last year is a tribute to the support that we have received from the team at Koh Young. We look forward to an even more successful 2016.”
About Koh Young Technology
Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com; contact the main office at 6150 W. Chandler Blvd., Suite #39, Chandler, AZ 85226. Office Tel: (480) 403-5000.
About Technica USA
Since 1985, Technica USA has been providing the fast paced, ever-changing electronics marketplace with the highest quality solutions available. Whether it is equipment for electronic assembly, selective solder and welding or cleaning, Technica enables its customers to maintain a competitive edge by providing state-of-the-art tools while also offering, improved quality and cost-efficient solutions.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.