ACE to Conduct Solderability Testing and Component Lead Tinning Workshop
November 29, 2015 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that it will conduct a one of a kind solderability testing and component lead tinning workshop. This much anticipated workshop will be held February 23-24, 2016 at ACE’s Spokane Valley, Washington facility and registration is now open and seats are available.
Removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation are the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. It is highly recommended the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with GEIA-STD-0006 to enhance component solderability.
The workshop will feature demonstrations of the hot solder dip method of both through-hole and SMT components featuring the ACE LTS200 and LTS300 lead tinning systems. ACE has a complete library of fixtures for lead tinning of virtually all through-hole and SMT components.
Also demonstrated during the workshop will be the new ACE STS-202 solderability tester that is capable of performing solderability testing to determine the solderability of component leads and terminations prior to being joined in a soldering operation. The system utilizes the proven dip and look test method in conformance with all IPC, ANSI and MIL standards including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208.
The workshop will feature a combination of classroom curriculum and hands-on demonstrations that clarify the requirements of the new J-STD-001 Rev F and GEIA-STD-0006 standards, as well as those who wish to advance their in-depth knowledge of the lead tinning process. For more information about this solderability and lead tinning workshop, or to register for the workshop, contact Rae Ann Miller at rmiller@ace-protech.com or call 509-924-4898, Ext. 102.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services.
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form
04/28/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.