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TRI Rolls Out the Future of Inspection at NEPCON Japan 2016
December 1, 2015 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON Japan 2016 exhibition. Visit us at ELECTROTEST booth E17-20 of Tokyo Big Sight from January 13 ~ 15, 2016 for a personal tour of the latest developments in PCBA inspection.
TRI’s 2016 portfolio includes new mid-range TR7700QI stop-and-go 3D AOI system designed for high-mix high-volume performance including mobile and PC applications. Also launching in 2016 are high accuracy stop-and-go 3D SPI TR7007QI and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete demoed inspection and testing range world's first dual mode AOI TR7700 SII Plus and TRI’s acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.
Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in the production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at ELECTROTEST booth E17-20 for a personal tour of TRI’s acclaimed solution lineup.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at marketing@tri.com.tw or call +886-2-2832 8918.
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