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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing

10/14/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market

09/16/2025 | Jesse Vaughan -- Column: Beyond the Board
The MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.

Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’

08/07/2025 | Dana Korf -- Column: Dana on Data
The global nature of electronics manufacturing requires clear, consistent, and precise communication, particularly in technical documentation. An area where miscommunication often arises is in interpreting drawing notes—small lines of text with the potential to dramatically impact product quality, manufacturing efficiency, and customer satisfaction.

IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

05/07/2025 | IPC
Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

Confidee Secures 5.5 MNOK Contract with Nordic Defence Actor

04/14/2025 | Confidee
Confidee is pleased to announce that it has secured a strategic contract valued at 5.5 MNOK with a leading Nordic Defence Actor. This reinforces Confidee´s position as a trusted partner in the defence industry.
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