Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Micro Industries Selling Excess Electronics Manufacturing Assets
December 2, 2015 | Micro IndustriesEstimated reading time: Less than a minute
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015.
The items in this event include a 2005 Speedline Vectra 450F “Lead-Free” Wave Solder; 2006 MPM UP2000 HiE Screen Printer; 2008 Asymtek Century C718 Dispenser; 2005 Heller 1809EXL Reflow Oven; Fuji 643 SMT Pick & Place; Fuji QP351E-MM SMT Pick & Place; Fuji & Hover-Davis SMT Feeders; Bliss Stencil Carts; Portable Clean Room; Portable Environmental Chamber; Arlink Workbenches; Conveyor Tech Conveyors; Oscilloscopes; Digital Multi-Meters; Power Supplies; Device Programmers; Rhode & Schwartz Analyzer and More…….
To view the complete line of items currently up for auction; please CLICK HERE.
Any questions about the event can be directed to Arlin Horsley at 1-813-992-2437.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.