Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Akrometrix LLC Debuts AKM600P - FOWLP Panel Warpage Measurement System
December 3, 2015 | Akrometrix LLCEstimated reading time: 1 minute
Akrometrix LLC, a leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full field of view warpage metrology system for panels up to 600 x 600 mm.
Scalable manufacturing technology is driving the industry’s need to move from wafer sized limitations in the FOWLP market to panel based manufacturing. This is a logical step to move beyond wafers to panel sized substrates, which have been used in the LCD industry for years.
Akrometrix’s AKM600P warpage measurement system enables customers to complete single shot warpage measurement of the entire panel and individual die on panels up to 600 x 600 mm simultaneously. The complete measurement and analysis of a panel of this size provides z-resolution down to 1.25 µm and takes less than two seconds to complete using the patented Shadow Moiré technology. Additionally, warpage measurements can be conducted at room temperature or up to 300°C for those needing thermal profiles.
“Akrometrix’s Shadow Moiré systems have become the industry standard for warpage measurement, especially at temperature,” noted Mayson Brooks, Akrometrix’s President and CEO. “With the emerging market for FOWLP in panel form, our technology is uniquely positioned to scale up to panel sized warpage measurements, sacrificing neither warpage resolution nor measurement acquisition time in moving from die size measurements to 600 x 600 mm measurements. The ability to measure both wafers and panels on the same equipment is the perfect ‘bridge’ tool as customers continue to do wafer processing while developing their panel technology.”
Share on:
Suggested Items
Kaynes Technology Acquires Canada-Based August Electronics
05/09/2025 | PRNewswireAugust Electronics Inc. is pleased to announce that it has entered into a definitive agreement to be acquired by Kaynes Canada Limited, a wholly owned step-down subsidiary of Kaynes Technology India Limited, a leading Electronics System Design & Manufacturing (ESDM) company. The transaction is expected to close by the end of May 2025, subject to customary regulatory approvals and closing conditions.
LITEON Technology Reports Consolidated April Sales of NT$13.4 Billion Up 27% YoY
05/09/2025 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$13.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 27% YoY.
Ultrahuman Expands its American Factory’s Manufacturing Capacity
05/09/2025 | GlobeNewswireUltrahuman, a pioneer in health optimization technology, has announced that it’s ramping up its capacity of the Ring AIR. Ultrahuman’s manufacturing facility (UltraFactory) in partnership with SVtronics, a US-based electronics manufacturing business, has been operational in Plano, Texas, since November 2024.
Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
05/08/2025 | BUSINESS WIREQuadric announced that Kyocera Document Solutions Inc. (hereinafter: Kyocera) has licensed the Chimera™ general purpose neural processor (GPNPU) intellectual property (IP) core for use in next generation office automation system on-chip (SoC) designs.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.