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Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
December 4, 2015 | Engineered Materials SystemsEstimated reading time: 1 minute
Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.
TSV Passivation/Sealing with EMS DF-1020 film
The DF-1000 series is available in various thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-1000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (by DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. Additionally, the film is hydrophobic in nature, providing for both chemical and moisture resistance.
DF-1000 series films are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and TSV passivation/sealing applications.
Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists, conductive and non-conductive adhesives for semiconductor and circuit assembly applications.
For more information about the DF-1000 series films or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit EMS/Nagase at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition or visit www.emsadhesives.com.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.
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