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Help IPC Persuade U.S. Congress to Extend the R&D Tax Credit
December 4, 2015 | John Hasselmann, IPCEstimated reading time: 1 minute

IPC has long urged the U.S. Congress to enact a permanent research and development tax credit – or at least a multi-year extension, not just the usual temporary, one-year deal – and to provide that certainty sooner, not at the last minute. Only a permanent credit will spur the kind of long-term R&D that is critical to the competitiveness of the U.S. electronics industry in the global economy. The R&D tax credit was one of the key issues raised last April during IMPACT 2015, our annual event in which IPC member executives meet with top policy makers in Washington, D.C.
Unfortunately, as of this writing, congressional leaders still have not been able to reach agreement on how to extend the R&D tax credit — which expired on December 31, 2014, and more than 50 other tax provisions that have expired or will expire by December 31. The proverbial “last minute” has arrived.
Within the coming days, congressional leaders are slated to discuss the best path forward, whether it be making some of the provisions permanent or simply extending all of them in a one- or two-year package. A one-year retroactive extension, which would include only 2015, simply continues the uncertainty that businesses face.
At this point, Finance Chairman Orrin Hatch (R-UT) has stated that a one-year extension is off the table but could resurface if a larger agreement is not reached.
Please take a moment now to contact your elected officials and urge them to extend the R&D tax credit without delay. Please feel free to use our suggested text or to craft your own message.
You can also join the conversation on Twitter; be sure to use the hashtag #JobsandGrowth and your elected representatives’ Twitter handles. Example: “Hey, Congress: Extend the R&D tax credit now! #JobsandGrowth @MEMBEROFCONGRESS HANDLE”
Please contact Ken Schramko, IPC director, government relations, if you need help with contact information for your elected official or if you have any questions.
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
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