-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Debuts Multi-Discipline Systems Engineering Tools for the Transportation Market
December 4, 2015 | PRNewswireEstimated reading time: 2 minutes
IESF Conference, Mentor Graphics Corporation today announced the availability of new tools delivering integrated electrical/electronic/software systems engineering capability for the transportation market. The new CapitalSystems tools allow implementations to be optimized for key parameters such as cost and weight. Unlike other approaches, engineers within the various disciplines do not need to understand one another's detailed syntax. This makes the new tools easy to deploy, leaving staff free to concentrate on design innovation.
Transportation platforms such as automobiles and aircraft are largely defined by their electrical/electronic systems, including embedded software. But implementation decisions, such as choosing the best processing resource for a software component, are hard to optimize because cross-discipline impacts are difficult to assess. For example, re-locating a software component may affect not only processor characteristics but also databus communications and wiring implementations. Given the scale of electrical/electronic content in modern vehicles, poor decisions can have significant impacts.
The problem can be solved by focusing on vehicle functions that will later be implemented as software, hardware, data communications, or electrical interconnect, and then assessing the impact of alternative implementations. The Capital Systems tools support functional connectivity capture, platform-level integration of those functions, and instant measurement of consequential impacts. Together they provide a complete environment to guide engineers to optimum decisions.
Luciano Lavagno, Professor of Electronics at Politechnico di Torino (Polytechnic University of Turin), who has a special research interest in hardware/software co-design, commented, "These tools are unique because they capture all high-level functionality aspects at a single abstraction level. This information is projected onto a representation of the host platform, which could be a car, an aircraft, or indeed a distributed system-of-systems. Real-time metrics immediately show engineers the effect of their decisions, allowing rapid optimization. No complex internal data mappings are needed, so the tools are ideal for fast adoption by staff responsible for system implementation decisions."
In practice new designs almost always build on data derived from previous projects. Moreover, the data describing implementation architectures must flow directly to detailed design processes within the various disciplines. For this reason the Capital Systems products provide extensive data connectivity. Martin O'Brien, general manager of Mentor's Integrated Electrical Systems Division, said, "These tools are seamlessly integrated with Mentor's Capital electrical and Volcano network/embedded software design flows. They also support data exchange with other vendors' tools, including adjacencies such as SysML systems modeling and 3D mechanical modeling."
The Capital Systems tools are part of the successful Capital® suite, an advanced software suite for the electrical systems and wire harness domain. Used by leading automotive and aerospace OEMs and suppliers worldwide, the Capital tool is built to support the complex demands of integrated processes from initial product definition through electrical system design, harness manufacture and vehicle maintenance.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months in excess of $1.24 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.