Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
The reactivated D-22 High Speed/High Frequency Design Subcommittee met to review an initial draft of IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. While agreed that the document is not intended to be used as a stand-alone document (it will support the IPC-2221B, Generic Standard on Printed Board Design), the initial draft does contain a substantial amount of “how-to 101” tutorial information for the designer as taken from the older IPC-2252, Design Guide for RF/Microwave Printed Boards. It was decided that IPC should conduct an open-ended industry survey that asks two basic questions to help steer the course of the IPC-2228:
- If a printed board fabricator switched up a job from an FR-4 board (IPC-6012) to an RF board (IPC-6018), what things would the fabricator need to focus on for that job (e.g. drilling, plating and marking)?
- What elements of fabrication and assembly are different between traditional rigid printed boards and RF printed boards that IPC should focus on (e.g. sequential lamination, back drilling and material handling)?
The D-22 High Speed/High Frequency Performance Subcommittee met to complete the process of reviewing and providing disposition to industry comments submitted during the summer 2015 Final Draft circulation of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The document will now be prepared for official balloting and a corresponding IPC-6018CS Space and Military Avionics Applications Addendum will also be drafted for a 2016 release.
The D-24a TDR Test Methods Task Group met to review the status of the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 2.5.5.7, Characteristic Impedance of Lines on Printed Boards by TDR.
The D-24b Bereskin Test Methods Task Group met to review two different industry approaches to addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. An IPC-TM-650 Test Method could be developed that provides both procedures as Methods A and B.
The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.
Page 2 of 3
Share on:
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
05/14/2025 | John Watson -- Column: Elementary, Mr. WatsonI've often been asked, "Can you have a perfect PCB design?" At first blush, it seems like the answer should be yes. After all, if you follow all the rules, double-check your work, and use the right tools, it should be perfect. Right?