Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
The D-31b IPC-2221/2222 Task Group met to advance the working draft of IPC-2226A, Sectional Design Standard for HDI Printed Boards, which is the first revision effort for this standard since its original 2003 publication. Attendees were segmented into five subgroups to work on content in sections 3 through 6.
The D-33a Rigid Printed Board Performance Task Group and the 7-31a IPC-A-600 Task Group met jointly to review and approve photographs of acceptable and nonconforming anomalies for the future “J” revision to IPC-A-600, Acceptability of Printed Boards. The photographs presented were intended to address new and expanded requirements released in the new IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards.
The D-35 Printed Board Storage and Handling Subcommittee met to complete the review of industry feedback to the working draft of an “A” revision to the IPC-1601, Printed Board Handling and Storage Guidelines. The group addressed comments related to measurement of moisture content, the use of oxidation arrest paper, the impact of baking on ENEPIG and ENIG surface finishes, and recommendations for resealing opened moisture barrier bags for storage of bare printed boards. A Final Draft for Industry Review will be circulated in Q4 2015.
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