The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
Global Citizenship: What I’ve Learned About the American PCB Business
Essemtec 3D Jet Printing, 3D Assembly Solutions on Spotlight at productronica 2015
December 8, 2015 | EssemtecEstimated reading time: 2 minutes
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, recently exhibited exceptional 3D jet printing and 3D assembly solutions at productronica 2015. Additionally, Essemtec presented an integrated work cell especially suitable for manufacturers who have to handle frequent product changes.
Assembly in 3D
Miniaturization in electronics has been an ongoing trend for several years. High integration density demands electro-mechanical assembly in 3D. Essemtec AG showcased a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform combines multiple process sequences to create complex micro devices, MEMS sensors, microwave assemblies and over- moulded lead frame components.
Integrated Work Cell for Rapid Prototyping
Two key success drivers in this industry are time-to-market and the ability to produce variants of similar products rapidly. For this reason Essemtec AG demonstrated a work cell comprised of a pick-and-place machine with integrated jet printing capability, a reflow oven and the Cubus SMT storage tower. Accurate inventory numbers and cost savings are achieved with seamless networked data integration. With this modest investment companies have the ability to rapidly test out new designs and produce small batches efficiently.
SMT Material Management
Cycle time for each production step in electronics manufacturing has been greatly reduced over the past years and further speed increases deliver only diminishing returns. However, experts believe that the optimization of material flow currently holds the greatest promise for overall productivity gain. This is where Cubus steps in! With its straightforward eStorage inventory management software, smooth integration to all major pick & place machines and fast processing, substantial productivity gains in SMT material management are achieved.
Page 1 of 2
Share on:
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.