Mek (Marantz Electronics) Launches Entry-Level, Low Cost Desktop AOI
December 8, 2015 | Mek (Marantz Electronics)Estimated reading time: 1 minute
The latest generation iSpector desktop AOI from Mek (Marantz Electronics) is designed as an entry-level system for customers with low volume, high mix production requiring high-quality AOI with a low price tag.
Mek’s new desktop solution offers benchtop PCB inspection with exceptional defect coverage. Providing a rapid, repeatable inspection process at an affordable cost, it’s a plug-and-play installation with iMentor online training and is exceptionally easy-to-program.
iSpector is able to inspect component bodies and solder joints by use of RGB LED light sources from three different angles. This allows 3D meniscus profiling to verify solder joints with low false call rates, accurate tolerance adjustment and amongst the highest defect detection rates in its class.
It utilizes the same powerful 22X software as Mek’s highly respected PowerSpector AOI series. There is no compromise on the wide range of inspection algorithms and component libraries. Complete management of part libraries is possible either on a single AOI system or across multiple machines.
It is fully compatible with Mek’s Catch System for classification, repair and SPC.
The Mek iSpector is currently available in M size (350x250mm) and desktop model only.
About Mek (Marantz Electronics Ltd)
A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 5000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.