Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Photo Stencil Sells Guadalajara, Mexico Laser Stencil Business to Management Team
December 9, 2015 | Photo Stencil, LLCEstimated reading time: 1 minute
Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, announces that it has sold the Photo Stencil business in Guadalajara, Mexico to the facility's management team, Francisco Lujano and Armando Berumen. Photo Stencil's Mexico facility produces laser-cut stencils and will continue to sell both the laser-cut stencils they manufacture and electroform stencils that will be made by Photo Stencil in its new Golden, CO facility.
"This sale is in keeping with our strategy to concentrate on producing high-end stencils and stencils for the semiconductor industry," said Eric Weismann, CEO of Photo Stencil. "Today's technology is being driven by more complex and densely packed boards, smaller devices, and more challenging applications. Our laser direct imaging capabilities can create extremely accurate stencils for solder paste printing of PCBs and for high density interconnects, BGAs, CSPs, and flex circuits. And, we're about to move into our new manufacturing plant that's equipped with cleanrooms, R&D facilities, and is set to deploy the most advanced processes for producing exacting stencils."
"Demand for our laser-cut stencils has increased significantly," said Francisco Lujano, former GM and new owner of Photo Stencil's Mexico facility. "Our Mexico plant has the latest laser cutting equipment with automated optical inspection. Armando and I are excited about this new opportunity and will continue to produce the highest performing laser-cut stencils available."
About Photo Stencil
Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens, and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries and is ISO 9001:2008 certified. Its innovations include the patented AMTX E-FAB® electroformed stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.