TTM Technologies Unveils Global Operating Model

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TTM Technologies, Inc., a major global printed circuit board manufacturer, today announced changes to its operating model that will create individual business units focused on customer end markets. Effective January 1, 2016, TTM's PCB Segment will be comprised of three BUs: Communications and Computing; Automotive, Medical, Industrial and Instrumentation; and Aerospace, Defense, and Specialty. The Electro-Mechanical Solutions Segment will be a single BU.

TTM CEO Tom Edman said, "This new structure allows us to align with our customers. It provides a global footprint to seamlessly support all their PCB needs from prototyping through volume production. Our new BU Presidents will be responsible for the financial performance of their respective BUs, key market segments, and the plants most closely associated with those segments. Our goal is to create a completely market-focused structure which we believe will further strengthen our competitive offerings around the globe, especially when paired with our advanced technologies and skilled employees."

As the Company transitions to the new operating model, it will reduce its workforce by approximately 80 employees worldwide. The Company anticipates it will incur one-time termination costs of approximately $3 to 4 million associated with the work force reduction. These organizational changes are also expected to generate approximately $10 million of predominately Selling, General and Administrative expenses synergy savings, which will largely be implemented by the end of the first quarter of 2016.

New Business Unit Leadership and Executive Team Appointments

Doug Soder will be President of the Communications and Computing BU, supporting customers in the cellular, networking, communications, and computing end markets. He currently serves as Executive Vice President and President of the North America BU.

Jon Pereira will be President of the Automotive, Medical, Industrial and Instrumentation BU, focused on customers in the automotive end market as well as the high-mix customer base serving the medical, industrial, and instrumentation markets. Jon currently serves as Senior Vice President of the Hi Reliability BU.

Philip Titterton will be President of the Aerospace, Defense and Specialty BU, supporting military and aerospace customers and specialty product offerings from a number of U.S. facilities. Phil currently serves as Chief Operating Officer of the North American BU.

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