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Augering in on Dispensing

09/19/2024 | Nolan Johnson, PCB007
In this interview with Sunny Agarwal, a senior applications and process engineer at Camalot Dispensers R&D, we talk about the choice between traditional methods and jet dispensing. Sunny says it depends on material properties, especially viscosity. Dispensing is very specific to application requirements, and excels in scenarios involving tall components, where precise droplet placement is crucial.

R2T2 Programme Partners with Orbex to Offer Pioneering PhD Opportunity in Aerospace Engineering

09/19/2024 | Orbex
The R2T2 consortium of universities is to partner with orbital launch services company Orbex to enable a PhD research candidate to gain hands-on experience.

Tata, Analog Devices Announce Strategic Alliance to Explore Joint Opportunities for Semiconductor Ecosystem in India

09/19/2024 | Analog Devices, Inc.
Tata Group, a global enterprise headquartered in India, and Analog Devices, Inc., a global semiconductor leader, announced a strategic alliance to explore potential cooperative manufacturing opportunities.

Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design

09/18/2024 | John Watson -- Column: Elementary, Mr. Watson
Imagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.

Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave

09/18/2024 | Intel
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.
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