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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
The D-64 Printed Electronics Final Assembly Subcommittee and D-64a Printed Electronics Terms and Definitions Task Group announced publication of IPC/JPCA-6901, Performance Requirements for Printed Electronics Assemblies and IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry), respectively. The groups will formally celebrate these new standards at APEX/EXPO.
D-64 is now undertaking development of IPC-6902, Qualification and Performance Specifications for Printed Electronics (Additive Circuitry). It is doing so as a joint effort with the D-61 Printed Electronics Design Subcommittee. That subcommittee launched work on IPC-2292, IPC-2292, Design Standard for Printed Electronics on Flexible Substrates, which will be the first in a potential series of design standards for printed electronics. Because these groups’ efforts are so closely intertwined, they will meet jointly throughout their processes.
The D-62 Printed Electronics Base Materials Substrates Subcommittee and D-63 Printed Electronics Functional Materials Subcommittee seek to expand the reach for the materials specification sheets in their standards. Both groups plan to create generic categories of materials and will begin gathering information from suppliers to build these categories and come up with requirement ranges for generic specification sheets.
The D-65 Printed Electronics Test Methods Development Subcommittee continues to make headway creating standardized testing for flexibility and stretchability.
Conflict Minerals
The E-30 Committee celebrated the publication of the Conflict Minerals Due Diligence White paper and discussed future plans to review and improve the white paper.
Page 2 of 2Suggested Items
TT Electronics Secures £20 Million in Aerospace and Defence Contracts as European Programmes Accelerate
06/06/2025 | TT ElectronicsTT Electronics has been awarded more than £20 million in new and renewed defence contracts, marking a major step forward in its contribution to Europe’s rapidly evolving defence landscape.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
Essemtec USA Welcomes Frank Hart as Head of Sales for North America
06/05/2025 | Essemtec USAEssemtec USA is proud to announce the appointment of Frank Hart as Head of Sales for North America, effective immediately. With over 30 years of experience in the SMT industry, Frank brings a wealth of knowledge, leadership, and a strong track record of success to our team.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswireNew Era Electronics, a leading provider of high-performance industrial computing solutions, announces the establishment of its first United States location in Salt Lake City, Utah. This strategic expansion to the U.S. underscores New Era Electronics' commitment to enhancing supply chain continuity and delivering exceptional services across North America.