'Hydricity' Concept Uses Solar Energy to Produce Power Round-the-Clock
December 16, 2015 | Purdue UniversityEstimated reading time: 3 minutes
Researchers are proposing a new "hydricity" concept aimed at creating a sustainable economy by not only generating electricity with solar energy but also producing and storing hydrogen from superheated water for round-the-clock power production.
"The proposed hydricity concept represents a potential breakthrough solution for continuous and efficient power generation," said Rakesh Agrawal, Purdue University's Winthrop E. Stone Distinguished Professor in the School of Chemical Engineering, who worked with chemical engineering doctoral student Emre Gençer and other researchers. "The concept provides an exciting opportunity to envision and create a sustainable economy to meet all the human needs including food, chemicals, transportation, heating and electricity."
Hydrogen can be combined with carbon from agricultural biomass to produce fuel, fertilizer and other products.
"If you can borrow carbon from sustainably available biomass you can produce anything: electricity, chemicals, heating, food and fuel," Agrawal said.
Findings are detailed in a research paper appearing this week (Dec. 14) in the online early edition of Proceedings of the National Academy of Sciences.
Hydricity uses solar concentrators to focus sunlight, producing high temperatures and superheating water to operate a series of electricity-generating steam turbines and reactors for splitting water into hydrogen and oxygen. The hydrogen would be stored for use overnight to superheat water and run the steam turbines, or it could be used for other applications, producing zero greenhouse-gas emissions.
"Traditionally electricity production and hydrogen production have been studied in isolation, and what we have done is synergistically integrate these processes while also improving them," Agrawal said.
Page 1 of 2
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.