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Alpha to Feature its First Sintering Preforms at Internepcon Japan 2016
December 16, 2015 | AlphaEstimated reading time: 1 minute
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA Argomax Ag sinter product range at the 2016 INTERNEPCON JAPAN show to be held in Tokyo from January 13–15.
Alpha will demonstrate its new Argomax 9000 Silver Sintering Preforms which is a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.
"This year we launched one of our most innovative products, the ALPHA Argomax 9000 preforms," said Julien Joguet, Alpha's Global Product Manager for Sintered Materials. "Up until now, ALPHA Argomax has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax."
Argomax 9000 preforms are proving to the most reliable die attach materials on the market. It can be used in a range of applications from power modules to automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.
To learn of other “Alpha firsts” in the semiconductor industry, please visit us at INTERNEPCON JAPAN - Hall East 5-4 and discover the multiple manufacturing process options that ALPHA Argomax offers.
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