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Most-Read PCB Design Articles of 2015
December 23, 2015 | Andy Shaughnessy, PCBDesign007Estimated reading time: 3 minutes

EchoStar’s Les Beller Shares the PCB Design-to-Fab Process
Recently, Barry Matties had the opportunity to meet and interview Les Beller of EchoStar Technologies. In this interview, Beller focuses on the many challenges circuit board designers face, strategies for bridging the gap between circuit design and fabrication, and the future of circuit designers.
Beyond Design: The Plain Truth About Plane Jumpers
Moats, islands, cut-outs in the ground plane, isolated power planes, floating ground regions, and a host of other intricate layout techniques are often used by PCB designers to reduce crosstalk, EMI, and to otherwise improve overall system performance. But a high-speed signal crossing a split in the plane causes problems along at least three dimensions, including signal quality, crosstalk, and EMI. Barry Olney explains.
Cadence’s Brad Griffin Digs Deep Into DDR
Guest Editor Kelly Dack stopped by the Cadence Design Systems booth at DesignCon 2015, where he sat down with Product Marketing Manager Brad Griffin to discuss Cadence’s advanced PCB design and signal integrity tools, and the company’s focus on DDR.
Trending at Freedom CAD: New Crop of Next‐Gen Designers
Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.
Material Witness: Low-Flow Prepregs–Defining the Process
Let’s try to define “low flow” in terms that will make sense to both suppliers and users of the products. A low-flow prepreg is a prepreg that flows sufficiently to wet out and adhere to bonding surfaces and to fill inner layer copper details, but does not flow so much as to fill in cut-out areas in a heat sink or run unevenly out of the interface between rigid and flexible elements of a rigid-flex PWB.
Make the Right Decisions at the Right Time in the PCB Design Process
Martin Cotton of Ventec explains why the right decisions are not always the easiest decisions, but making them well and as early as possible often avoids errors and addition costs. This is certainly the case in PCB design and a key decision influencing the design process and the eventual outcome is the selection of material and of the materials vendor.
Nick Barbin: From Designer to EMS Company Owner
Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. I caught up with Nick recently and asked him how he wound up leading an EMS company on the Inc. 5000 list.
Broadcom PCB Design: Miniaturization on the Cutting Edge
Andy Shaughnessy recently attended the Orange County Designer's Council “Lunch and Learn” meeting, held at the Broadcom offices on the campus of the University of California, Irvine. Afterward, he sat down with Scott Davis, CID, the senior manager of PC board design at Broadcom, to discuss the company’s savvy PCB design department and their approach to PCB design.
Max Maxfield Looks at the Future of Electronics
Clive "Max" Maxfield has worked for decades in this industry, and in a variety of capacities: Engineer, author, editor, columnist, blogger, and keynote speaker. Editor Andy Shaughnessy caught up with his former columnist recently and asked him what he'd been doing to stay out of trouble, and what sort of technology and futuristic electronic gadgets were piquing his interest now.
Ten Considerations for Outsourcing PCB Designs
Outsourcing your design work is a big deal. How do you know that the end-result will be as you envisaged? Will you have full control of your design? Will it be done to the quality you expect and within the time frame required? Outsourcing can pose some fairly scary questions, so what are the key things to consider and what are the pitfalls to avoid?
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.