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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron Unveils Ultra-Dense Memory Module for Next-Gen Servers

09/18/2026 | Micron
Micron Technology, Inc., announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms.

GlobalFoundries, Marvell Expand Collaboration for Next-generation Optical Connectivity

09/18/2026 | GlobalFoundries
GlobalFoundries (GF) and Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced an expanded multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont, facility to support growing demand for next-generation optical connectivity.

REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing

09/17/2026 | Global Electronics Association
The Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil. Europe is one of the world’s three largest markets for AI data centres.

Google to Invest €13 Billion in Finland AI Infrastructure Over Two Years

09/16/2026 | Google
Google announced plans to invest at least €13 billion in digital infrastructure in Finland over the next two years (2027 - 2028), deepening its long-term commitment to the country and to Europe.

Data Center Power Demand to Rise 31% in 2026, Grid Gap to Widen in 2028

09/16/2026 | TrendForce
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications.
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