Optoelectronic Microprocessors Built using Existing Chip Manufacturing
December 24, 2015 | MITEstimated reading time: 4 minutes
The chip has 850 optical components and 70 million transistors, which, while significantly less than the billion-odd transistors of a typical microprocessor, is enough to demonstrate all the functionality that a commercial optical chip would require. In tests, the researchers found that the performance of their transistors was virtually indistinguishable from that of all-electronic computing devices built in the same facility.
Computer chips are constantly shipping data back and forth between logic circuits and memory, and today’s chips cannot keep the logic circuits supplied with enough data to take advantage of their ever-increasing speed. Boosting the bandwidth of the electrical connections between logic and memory would require more power, and that would raise the chips’ operating temperatures to unsustainable levels.
Optical data connections are, in principle, much more energy efficient. And unlike electrical connections, their power requirements don’t increase dramatically with distance. So optical connections could link processors that were meters rather than micrometers apart, with little loss in performance.
The researchers’ chip was manufactured by GlobalFoundries, a semiconductor manufacturing company that uses a silicon-on-insulator process, meaning that in its products, layers of silicon are insulated by layers of glass. The researchers build their waveguides — the optical components that guide light — atop a thin layer of glass on a silicon wafer. Then they etch away the silicon beneath them. The difference in refractive index — the degree to which a material bends light — between the silicon and the glass helps contain light traveling through the waveguides.
Conflicting needs
One of the difficulties in using transistor-manufacturing processes to produce optical devices is that transistor components are intended to conduct electricity, at least some of the time. But conductivity requires free charge carriers, which tend to absorb light particles, limiting optical transmission.
Computer chips, however, generally use both negative charge carriers — electrons — and positive charge carriers — “holes,” or the absence of an electron where one would be expected. “That means that somewhere in there, there should be some way to block every kind of [carrier] implant that they’re doing for every layer,” Ram explains. “We just had to figure out how we do that.”
In an optoelectronic chip, at some point, light signals have to be converted to electricity. But contact with metal also interferes with optical data transmission. The researchers found a way to pattern metal onto the inner ring of a donut-shaped optical component called a ring resonator. The metal doesn’t interact with light traveling around the resonator’s outer ring, but when a voltage is applied to it, it can either modify the optical properties of the resonator or register changes in a data-carrying light signal, allowing it to translate back and forth between optical and electrical signals.
Page 2 of 3
Suggested Items
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
IT Distribution Records Strong Revenue Growth in Q1 Fueled by Personal Computing Purchases Amidst Tariff Uncertainty
05/02/2025 | IDCSales through distribution in North America posted a second consecutive quarter of growth in the first quarter of 2025. Distributor Revenues came in at $19.9B which is a 7.6% increase year-over-year, according to the International Data Corporation (IDC) North America Distribution Track e r (NADT).
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.