It’s Only Common Sense: AI Makes Preparation Easier and Excuses Harder
Happy’s Tech Talk #50: Start Your Digitalization Strategy With Automation
The Chemical Connection: A Few Things That Still Scare Me
Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications.
7. George Milad: ENEPIG—The Plating Process
Electroless nickel/electroless palladium/immersion gold (ENEPIG) is sometimes referred to as the universal finish, because of the versatility of its applications. It is a multifunctional surface finish, applicable to soldering and wire bonding (gold, aluminum, copper and palladium clad copper).
8. Mark Goodwin: A Well-Designed Laminate Supply Chain has to Own It!
Designing a supply chain for the provision of laminates and prepregs to the pcB fabricator shouldn’t be that complicated, should it? The laminate is simply manufactured and then shipped...what could possibly go wrong?
9. Dan Feinberg: Automotive Technology—the Next Driving Force in Electronic Manufacturing
We started with aM and then FM radios, then full stereo systems complete with tape, then disk, then SSD storage; we added speed control then GPS, and then mapping. the higher-end vehicles now have collision and obstruction warning, back-up cameras, driver fatigue warning… and some have self-parking… But in the automotive segment, as the man once said, “You ain’t seen nothing yet.”
10. Todd Kolmodin: Splitting Hairs—The Manufacture of HDI and Substrate Test Fixtures
Testing of higher-density product has become ever more challenging with the advancement of chip technology. BGAs, CCDs and other active components have decreased in size so much that historical industry accepted test methodology can no longer effectively test these newer substrates incorporating this higher technology.
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