Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
2015's Most Read SMT Interviews
December 30, 2015 | I-Connect007Estimated reading time: 2 minutes
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
Read this interview with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox’s expansion plans for North America and Malaysia. Dill also describes the highly successful veteran’s training program in Longmont, Colorado.
California Congressman Mike Honda Discusses American Manufacturing
Barry Matties, Publisher of I-Connect007, sat down with Congressman Honda, who represents District 17 in the Silicon Valley, and talked with him about American manufacturing, infrastructure, education and some of the current thinking in America.
A Conversation (and Day) with Joe Fjelstad
Industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met up with Barry Matties recently to spend a day together enjoying their conversation that ebbed and flowed between a wide variety of topics including the “war against failure.”
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Arizona, Anaya Vardya, CEO of American Standard Circuits discussed the current market trends, the company’s recent equipment investments, and where ASC’s growth will likely come from.
BGA or CGA: When Is It Right for You?
This interview with TopLine president and founder Martin Hart focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.
A Look at the High-Reliability Interconnect Market
In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company’s activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.
Solder Jet Printing: Is It the Right Time?
Publisher Barry Matties gets an update from Nico Coenen, sales director for Mycronic, on their solder jet printing system. Mycronic has been developing and pioneering this technology for 10 years and they believe now is the time for it to gain real traction.
A Look at Saki’s Approach to 2D, 3D and X-ray Technology
At NEPCON 2015 we sat down with Nori Koike, COO of Saki of Japan, to discuss the latest demands for 3D and their approach to inspection. Saki has built a line-up of tools that covers the inspection spectrum.
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