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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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2015’s Most Read PCB Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
EIPC Summer Conference, Berlin
The 2015 EIPC Summer Conference attracted delegates to Berlin from sixteen countries to experience 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organization.
HDPUG Demonstrates Benefits of Cooperative R&D
The High-Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Characterization of PCB Material & Manufacturing Technology for High-Frequency
Concepts like Industry 4.0, Internet of Things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement— a considerable amount of data and increased data transfer rate. the aim of this paper is to develop a concept to use materials in combination with optimized pcB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
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Sweeney Ng - CEE PCBSuggested Items
North American EMS Industry Down 8.9% in June
07/29/2025 | Global Electronics AssociationThe Global Electronics Association announced today the June 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.28.
Sanmina Reports $2.04B Revenue for Q3 Fiscal 2025
07/29/2025 | Sanmina Corp.Sanmina Corporation, a leading integrated manufacturing solutions company, reported financial results for the third quarter ended June 28, 2025 and outlook for its fourth fiscal quarter ending September 27, 2025.
ITW EAE Expands Production Capabilities for Centurion Reflow Ovens and Momentum II Printers
07/29/2025 | ITW EAEITW EAE, a global leader in innovative manufacturing solutions, is pleased to announce production capabilities for the Vitronics Soltec Centurion reflow oven and MPM Momentum II Elite and HiE stencil printers at its Camdenton, Missouri facility in addition to its existing manufacturing facility in Suzhou, China.
Safran Announces the Acquisition of Flight Control and Actuation Activities from Collins Aerospace
07/28/2025 | SafranSafran announces the closing of the acquisition of Collins Aerospace’s flight control and actuation activities which are mission critical systems for commercial and military aircraft, and helicopters.
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
07/29/2025 | Shane Whiteside -- Column: American Made AdvocacyLast month, PCBAA held its fourth annual meeting in Washington, D.C. It was our largest gathering to date and included speakers from the House and Senate, the Department of Commerce, and OEMs Lockheed Martin, RTX, and Northrop Grumman. We also spent a day on Capitol Hill educating lawmakers and their staff about the importance of a secure domestic microelectronics supply chain.