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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Mentor Webinar: Maximizing the Accuracy of FloTHERM Models
January 6, 2016 | I-Connect007Estimated reading time: 1 minute
This January 20 webinar will introduce the new capability in FloTHERM v11.1 to automatically calibrate FloTHERM models to match T3Ster measurements. T3Ster measurements capture the full transient thermal characteristics of a device, and converts this into industry standard Structure Function curves.
When a FloTHERM model of a device can produce the same Structure Function measured by T3Ster, the user can ensured that the FloTHERM model accurately includes all package time constants and will respond correctly in any steady state or transient application. The webinar will describe why the calibration process is important to thermal design, and the steps required in FloTHERM v11.1 to produce a calibrated model.
The webinar will take place January 20 at 10 am Pacific, and 11 am London time. For more information, click here.
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Rachael Temple - AlltematedSuggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.