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Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
Creating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
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Mentor Webinar: Maximizing the Accuracy of FloTHERM Models
January 6, 2016 | I-Connect007Estimated reading time: Less than a minute
This January 20 webinar will introduce the new capability in FloTHERM v11.1 to automatically calibrate FloTHERM models to match T3Ster measurements. T3Ster measurements capture the full transient thermal characteristics of a device, and converts this into industry standard Structure Function curves.
When a FloTHERM model of a device can produce the same Structure Function measured by T3Ster, the user can ensured that the FloTHERM model accurately includes all package time constants and will respond correctly in any steady state or transient application. The webinar will describe why the calibration process is important to thermal design, and the steps required in FloTHERM v11.1 to produce a calibrated model.
The webinar will take place January 20 at 10 am Pacific, and 11 am London time. For more information, click here.
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BTU International Appoints E-Tronix as Its Representative in Six States
07/16/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce the appointment of E-Tronix as its representative in North Dakota (ND), South Dakota (SD), Minnesota (MN), Iowa (IA), Wisconsin (WI) and Illinois (IL).
UHDI Fundamentals: UHDI for RF Microwave Applications
07/16/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2
07/10/2024 | I-Connect007 Editorial TeamThe evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
06/14/2024 | Indium CorporationIndium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.