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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
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Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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Mentor Webinar: Maximizing the Accuracy of FloTHERM Models
January 6, 2016 | I-Connect007Estimated reading time: Less than a minute
This January 20 webinar will introduce the new capability in FloTHERM v11.1 to automatically calibrate FloTHERM models to match T3Ster measurements. T3Ster measurements capture the full transient thermal characteristics of a device, and converts this into industry standard Structure Function curves.
When a FloTHERM model of a device can produce the same Structure Function measured by T3Ster, the user can ensured that the FloTHERM model accurately includes all package time constants and will respond correctly in any steady state or transient application. The webinar will describe why the calibration process is important to thermal design, and the steps required in FloTHERM v11.1 to produce a calibrated model.
The webinar will take place January 20 at 10 am Pacific, and 11 am London time. For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
Thermal Interface Materials – Transition to High-Performance Materials
08/18/2025 | IDTechExIDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G.
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.