Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Mentor Webinar: Maximizing the Accuracy of FloTHERM Models
January 6, 2016 | I-Connect007Estimated reading time: Less than a minute
This January 20 webinar will introduce the new capability in FloTHERM v11.1 to automatically calibrate FloTHERM models to match T3Ster measurements. T3Ster measurements capture the full transient thermal characteristics of a device, and converts this into industry standard Structure Function curves.
When a FloTHERM model of a device can produce the same Structure Function measured by T3Ster, the user can ensured that the FloTHERM model accurately includes all package time constants and will respond correctly in any steady state or transient application. The webinar will describe why the calibration process is important to thermal design, and the steps required in FloTHERM v11.1 to produce a calibrated model.
The webinar will take place January 20 at 10 am Pacific, and 11 am London time. For more information, click here.
Share on:
Suggested Items
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Akrometrix LLC Reports a Record Year of Revenue for 2024
03/04/2025 | Akrometrix LLCAkrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.
RTX's Collins Aerospace EPACS Power and Thermal Management System Ready for Aircraft Integration
03/04/2025 | RTXCollins Aerospace, an RTX business, has successfully tested a fully functional demonstrator of its next-generation power and thermal management system (PTMS).