X-rays Reveal Details of Plastic Solar Cell Production
January 13, 2016 | TECHNICAL UNIVERSITY OF MUNICH (TUM)Estimated reading time: 3 minutes

Plastic solar cells are light, easy to install, and readily produced using a printer. Nevertheless, the processes that take place on the molecular scale during the production of organic solar cells are not yet entirely clear. Researchers from the Technical University of Munich (TUM) have now managed to observe these processes in real time. Their findings, which are published in the specialist journal Advanced Energy Materials, could help to improve the efficiency of organic solar cells.
The solar modules that can be seen on the roofs of many houses mainly consist of the semiconductor silicon. They are heavy and consequently costly to secure on roofs. Moreover, they do not blend in very well with their surroundings.
Organic solar cells, which consist of organic molecules like plastic bags or cling film, are an alternative to these conventional solar cells. Organic solar cells are soluble and can therefore be produced using a printer. Since they are very thin and light weight the installation of this thin light converting device in a variety of different locations is feasible, furthermore, the color and shape of the solar cells can also be adjusted. One of the current disadvantages is, however: The efficiency of organic photovoltaics has not yet reached that of silicon solar cells.
Processes at the nano level
One of the key parameters for harvesting more energy from the flexible solar cells is the arrangement of the molecular components of the material. This is important for the energy conversion because, as in the case of the "classic" solar cell, free electrons must be produced. To do this, organic solar cells need two types of material, one that donates electrons and another one that accepts them. The interface between these materials must be as large as possible to convert light into electricity. Up to now, it was not known exactly how the molecules align with each other during the printing process and how the crystals they form grow during the drying process. Like the pigments in printer ink, the molecules are initially contained in a solution.
"In order to be able to control the arrangement of the components, we need to understand what happens at the molecular level during the drying process," explains Dr. Eva M. Herzig from the Munich School of Engineering (MSE) at TUM. To resolve such small structures inside a drying film with adequate time resolution presents an experimental challenge.
Page 1 of 2
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.