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Learning With Leo: Observations from IPC Builds in Paris

11/04/2026 | Leo Lambert -- Column: Learning With Leo
I spent a week in Paris in September at the IPC Builds meetings, and it gave me the chance to see, take part in, and document a broad range of technical and training-related discussions affecting the electronics manufacturing industry. I go to these meetings because what gets decided in those rooms ends up in the classes we teach at EPTAC. In addition to attending committee meetings, I participated in keeping minutes for several sessions because some meeting leaders were unable to attend due to travel restrictions.

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.

Fresh PCB Concepts: Don't Let Over-specification Come Back to Haunt You

10/22/2026 | Team NCAB -- Column: Fresh PCB Concepts
In my career, I never imagined a shortage of FR-4 materials like the one we see today, a situation that has frustrated both PCB manufacturers and customers. FR-4 materials are highly substitutable when compared to exotic materials, so if a factory does not have one specific brand of FR-4, they will typically have an equivalent material in stock. This forces our customers to choose between waiting an unreasonable amount of time for the branded materials to arrive at the factory and waiting a slightly shorter time for the substituted materials.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

Breaking Down the Barriers Between Design and Manufacturing in France

10/15/2026 | Marcy LaRont, I-Connect007 Magazine
The IPC Designers Council France has nearly doubled since I-Connect007 last reached out to Thomas Romont, a manager at WWEC who leads the council. But growth is only part of the story. Through working groups, practical design tools, and an annual conference, the council is creating opportunities for designers, engineers, fabricators, EMS providers, and other stakeholders to solve problems together. Thomas explains how the group is addressing gaps in design guidance, improving communication between design and manufacturing, and encouraging the kind of collaboration increasingly required across the electronics industry.
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