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All About Flex: High-Temperature Performance Flexible Circuits
January 21, 2016 | Dave Becker, All FlexEstimated reading time: 2 minutes
The new set of high-temperature constructions pose few limitations; however, applications are unique and testing within a simulated end use environment is always a good discipline. A variety of constructions meeting UL flammability requirements are available, with many of the chemical and mechanical properties of these new constructions similar to the existing polyimide constructions used in military and commercial applications. While some of the many material constructions used for flexible circuit fabrication may have slightly different flexibility properties, the flex properties of the new materials are similar to traditional laminates.
With high-temperature applications continuing to grow in demand, materials and processes required to support these challenging applications are becoming available. Fabricators are stocking the materials required to provide quick-turn delivery and support adoption in high-performance applications. Be careful when you pick-up that flex circuit…you might get burned.
References
1. IPC TMM 2.4.13.1 solder float test for thermal stress of laminates.
Dave Becker is vice president of sales and marketing at All Flex Flexible Circuits LLC.
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