Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
All About Flex: High-Temperature Performance Flexible Circuits
January 21, 2016 | Dave Becker, All FlexEstimated reading time: 2 minutes
The new set of high-temperature constructions pose few limitations; however, applications are unique and testing within a simulated end use environment is always a good discipline. A variety of constructions meeting UL flammability requirements are available, with many of the chemical and mechanical properties of these new constructions similar to the existing polyimide constructions used in military and commercial applications. While some of the many material constructions used for flexible circuit fabrication may have slightly different flexibility properties, the flex properties of the new materials are similar to traditional laminates.
With high-temperature applications continuing to grow in demand, materials and processes required to support these challenging applications are becoming available. Fabricators are stocking the materials required to provide quick-turn delivery and support adoption in high-performance applications. Be careful when you pick-up that flex circuit…you might get burned.
References
1. IPC TMM 2.4.13.1 solder float test for thermal stress of laminates.
Dave Becker is vice president of sales and marketing at All Flex Flexible Circuits LLC.
Page 2 of 2
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.