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February 5, 2016 | EIPCEstimated reading time: Less than a minute

In this Issue
- Samsung Elec warns of difficult 2016 as smartphone troubles spread
- Agfa Materials commits to continue the supply of film
- New President at Mesago
- Bisphenol F found in mustard products
- Ventec International expands UK operations with investment in new manufacturing equipment
- Energy-saving micro-computers for the Internet of Things
- IPC
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Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
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Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA
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