Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Kurtz Ersa Hires Technica to Keep Up With Growing Demand
February 5, 2016 | Kurtz Ersa North AmericaEstimated reading time: 1 minute
Kurtz Ersa North America has hired Technica USA as its newest manufacturers' representative. Technica will represent Ersa in a wide territory, spanning from Northern California, Northern Nevada and Oregon, to Washington, Idaho, Colorado, Utah, Wyoming and Nebraska.
"Technica USA has the geographic footprint that we were looking for. In addition, their Demo & Training Center in San Jose, California allows us to have our soldering equipment readily available for customers in the Silicon Valley," said Ernie Grice, Vice President of Sales for Kurtz Ersa North America.
Frank Medina, president/CEO of Technica, commented, "We are very pleased to have the opportunity to partner with Kurtz Ersa. They are a worldwide leading producer of quality reflow, selective and waver solder equipment. Most importantly, they share our philosophy of bringing value to our customers in many different ways, including through our Demo and Training Center."
Established in 1985, Technica USA continues to provide the highest quality products for the fast-paced, ever-changing electronics marketplace. The company aims to bring together only the industry-leading suppliers that have developed innovative products that will provide manufacturers with a true technological advantage to produce complex electronic products.
Technica USA will represent Ersa’s selective soldering, reflow ovens and wave soldering machines.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.