SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Alpha to Feature Preforms Sintering Technology at APEC POWER EXPO 2016
February 9, 2016 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA Argomax Ag sinter product range at the 2016 APEC show, booth #1561, to be held in Long Beach, California from March 20– 24.
Alpha will demonstrate its new Argomax® 9000 Silver Sintering Preforms which is a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.
“This year we launched one of our most innovative products, the ALPHA Argomax 9000 preforms”, said Julien Joguet, Alpha’s Global Product Manager for Sintered Materials. “Up until now, ALPHA Argomax has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax”.
Argomax 9000 preforms are proving to the most reliable die attach materials on the market. It can be used in a range of applications from power modules to Automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.
To learn of other “Alpha firsts” in the semiconductor industry, please visit us at APEC, Booth #1561 and discover the multiple manufacturing process options that ALPHA Argomax offers.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.