Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Alpha to Feature Preforms Sintering Technology at APEC POWER EXPO 2016
February 9, 2016 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA Argomax Ag sinter product range at the 2016 APEC show, booth #1561, to be held in Long Beach, California from March 20– 24.
Alpha will demonstrate its new Argomax® 9000 Silver Sintering Preforms which is a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.
“This year we launched one of our most innovative products, the ALPHA Argomax 9000 preforms”, said Julien Joguet, Alpha’s Global Product Manager for Sintered Materials. “Up until now, ALPHA Argomax has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax”.
Argomax 9000 preforms are proving to the most reliable die attach materials on the market. It can be used in a range of applications from power modules to Automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.
To learn of other “Alpha firsts” in the semiconductor industry, please visit us at APEC, Booth #1561 and discover the multiple manufacturing process options that ALPHA Argomax offers.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.