The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Scanfil to Restructure Operations in Cambridge
February 19, 2016 | ScanfilEstimated reading time: 1 minute
Scanfil Sweden AB’s (former PartnerTech AB) English subsidiary, Scanfil Limited, informed the company’s personnel about the intention to restructure the company’s operations. Scanfil Limited has also announced that it will initiate a communication and negotiation process with the representatives of the personnel groups, in accordance with English legislation. The option of discontinuing production at the factory will also be discussed in the negotiations. The restructuring negotiations concern all personnel in Scanfil Limited.
If the negotiation ends up in discontinuing operations at the factory, no significant impact on earnings is expected for the year 2016. Turnover of Scanfil Limited in 2015 was about EUR 6.1 million and operating loss about EUR 1.1 million.
About Scanfil
Scanfil is an international contract manufacturer and system supplier for the electronics industry with 40 years of experience in demanding contract manufacturing. Scanfil provides its customers with an extensive array of services, ranging from product design to product manufacturing, material procurement and logistics solutions. Vertically integrated production and a comprehensive supply chain are the foundation of Scanfil’s competitive advantages: speed, flexibility and reliability.
Typical Scanfil products include mobile and communications network devices, automation system modules, frequency converters, lift control systems, analysers, various slot and vending machines, and devices related to medical technology and meteorology. Scanfil services are used by numerous international automation, energy, IT and health service providers, as well as companies operating in the field of urbanization. Scanfil’s network of factories consists of 16 production units in Europe, Asia and North America. The total number of employees is 3,500.
Share on:
Suggested Items
Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.
Modernizing TAURUS for the Bundeswehr
12/25/2024 | MBDAThe Bundeswehr and TAURUS Systems GmbH (a joint venture between MBDA and SAAB) have signed a contract for the maintenance and modernization of the TAURUS stand-off weapon system. The measures will ensure the weapon's operational readiness until at least 2045.
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Two Additional Boeing O3b mPOWER Satellites Successfully Communicating in Space
12/23/2024 | BoeingTwo more Boeing-built O3b mPOWER satellites are sending and receiving signals in space after launching from the Kennedy Space Center, Florida at 5:26 p.m.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.