-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Torenko & Associates Adds Salesman in Mexico
February 22, 2016 | Torenko and AssociatesEstimated reading time: Less than a minute

Torenko and Associates, a manufacturers’ representative organization specializing in the sales and marketing of premier electronic assembly equipment, production tools, test, repair, inspection and consumable products, has hired Angel Romero. A seasoned veteran, Mr. Romero joins the company’s sales team in Matamoros and Reynosa, Mexico.
Mr. Romero has more than 25 years of experience in process and sales, having worked for Siemens, Delco and Interlatin. “With Angel’s experience in process and technology, he will be an asset to our customers in Matamoros and Reynosa, Mexico,” says Ron Torenko, CEO and President of Torenko & Associates. “We are very pleased to have Angel aboard with Torenko.”
Torenko and Associates is a large and expanding organization that covers the southern central U.S. states of Texas, Oklahoma, Louisiana, Arkansas, and the border and interior of Mexico. Torenko partners with Vectralis Engineering in Mexico for applications and service support.
About Torenko and Associates
Torenko and Associates was founded by Ron Torenko and is headquartered in the Dallas/Fort Worth metroplex with other locations in the regional USA and Mexico. Sales Engineering personnel are factory trained, process knowledgeable, and have process experts standing by for assistance via conference calling and onsite meetings.
Suggested Items
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.