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Boyd Opens State of the Art Battery Material Test Lab to Safely Accelerate Battery Design and New Product Introduction

04/09/2025 | Boyd Corporation
Boyd, a leader in battery thermal propagation prevention and thermal runaway containment technology, announced the grand opening of its cutting-edge battery material test laboratory in San Jose, California.

Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations

04/09/2025 | Real Time with...IPC APEX EXPO
Mark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.

New Guide Offers In-Depth Look at Thermal Management in PCB Design

04/09/2025 | I-Connect007
I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.

epoxySet Introduces EC-1019 – Thermally Conductive, Crack Resistant Epoxy Potting

04/07/2025 | epoxySet
epoxySet introduces the EC-1019, specialized epoxy potting compound.  This system utilizes unique chemistry and fillers to offer a thermally conductive compound that has very small particulate size of about 15um.

IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging

04/09/2025 | Tracy Riggan, IPC
The IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.
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