-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueMechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
Creating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
ICD Releases 2016 Edition of the ICD Stackup Planner
February 22, 2016 | In-Circuit Design Pty LtdEstimated reading time: 1 minute
In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2016 edition of its popular software.
“With this release, we have developed a new PDN EMI plot. The EMI plot represents the projected maximum radiated noise if a high-speed signal excites the plane resonance at a particular frequency,” said CEO Barry Olney. “Plus the applicable EMC standard can be selected from the EMC Limit pull-down menu. In Australia, we comply with the CISPR standard that is also the European standard. The United States complies to the FCC and in Japan the VCCI standard.”
The ICD Stackup Planner is delivered with an extensive Dielectric Materials Library (DML) containing over 23,300 commonly used rigid and flexible core, prepreg and solder mask/coverlay materials up to 100GHz. This is arguably the most comprehensive list of material properties ever compiled. Using the exact materials that are stocked by your preferred fabricator can increase accuracy by up to 5%. For a complete list of material manufacturers and product types that are included in the ICD Stackup Planner, click here.
A new Relative Signal Propagation bar graph compares matched ‘length’ to ‘delay’. So, if you have a DDR data bus, for instance, that is routed to 1.8”, you can see how much length you have to add to each signal layer to achieve matched delay.
2016 release highlights:
- PDN EMI Plot with FCC, CISPR and VCCI, Class A and B EMC limits
- New manufacturers select list in libraries – now super fast selection
- Relative Signal Propagation bar graph
- Dielectric materials library of over 23,300 rigid and flexible materials up to 100GHz. For a full list of manufacturers, click here. The Capacitor Library of over 5,600 now features Samsung caps
- Graph legend – turn on/off the legend on the PDN plots for a larger plot
- Automatic updates – checks for a latest version
Also, many product videos are available to be viewed online at www.icd.com.au
Please see the 2016 release update video
About In-Circuit Design Pty Ltd
In-Circuit Design Pty Ltd, based in Australia, developer of the ICD Stackup and PDN Planner software, is a PCB design service bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please visit www.icd.com.au
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.