Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
ICD Releases 2016 Edition of the ICD Stackup Planner
February 22, 2016 | In-Circuit Design Pty LtdEstimated reading time: 1 minute
In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2016 edition of its popular software.
“With this release, we have developed a new PDN EMI plot. The EMI plot represents the projected maximum radiated noise if a high-speed signal excites the plane resonance at a particular frequency,” said CEO Barry Olney. “Plus the applicable EMC standard can be selected from the EMC Limit pull-down menu. In Australia, we comply with the CISPR standard that is also the European standard. The United States complies to the FCC and in Japan the VCCI standard.”
The ICD Stackup Planner is delivered with an extensive Dielectric Materials Library (DML) containing over 23,300 commonly used rigid and flexible core, prepreg and solder mask/coverlay materials up to 100GHz. This is arguably the most comprehensive list of material properties ever compiled. Using the exact materials that are stocked by your preferred fabricator can increase accuracy by up to 5%. For a complete list of material manufacturers and product types that are included in the ICD Stackup Planner, click here.
A new Relative Signal Propagation bar graph compares matched ‘length’ to ‘delay’. So, if you have a DDR data bus, for instance, that is routed to 1.8”, you can see how much length you have to add to each signal layer to achieve matched delay.
2016 release highlights:
- PDN EMI Plot with FCC, CISPR and VCCI, Class A and B EMC limits
- New manufacturers select list in libraries – now super fast selection
- Relative Signal Propagation bar graph
- Dielectric materials library of over 23,300 rigid and flexible materials up to 100GHz. For a full list of manufacturers, click here. The Capacitor Library of over 5,600 now features Samsung caps
- Graph legend – turn on/off the legend on the PDN plots for a larger plot
- Automatic updates – checks for a latest version
Also, many product videos are available to be viewed online at www.icd.com.au
Please see the 2016 release update video
About In-Circuit Design Pty Ltd
In-Circuit Design Pty Ltd, based in Australia, developer of the ICD Stackup and PDN Planner software, is a PCB design service bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please visit www.icd.com.au
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.