-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
March 8, 2016 | Ventec International GroupEstimated reading time: 2 minutes

Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, unveiled their high-speed/low-loss product portfolio, tec-speed, in January 2016. Ventec will be showcasing the range globally at a number of shows this year. Starting with IPC APEX EXPO in Las Vegas (15-17 March 2016), tec-speed will be a highlight at Ventec’s booth number 827 with an emphasis on the mil/aero applications.
Tec-speed unites Ventec's high-speed/low-loss product portfolio and better positions the range under a single identity, connecting the products through a clear and cohesive visual presentation. The tec-speed laminates and prepregs range from mid-loss (Df 0.012) to ultra-low-loss (Df 0.003) specifications with Dk levels ranging between 3.9 and 3.2, offering the ultimate in laminate technology and quality assurance through Ventec's proprietary manufacturing and distribution network.
Jack Pattie, president of Ventec USA, said, “Thermal performance and signal integrity demands are increasing, particularly for mil/aero applications where miniaturization and density of components are pushing the boundaries of PCB design. Tec-speed materials and our strategic roadmap of new innovative additions to the range, provide the technological innovation, high performance and quality demanded by our customers.”
A selection of products will be highlighted at the show, including:
- tec-speed 6.1 (Dk 3.2, Df 0.004 RC 50%) - Ultra-Low Loss High-Tg material available with all copper styles, including HVLP. Uses low Dk spread glass to improve skew and jitter. Applications include telecom, router, servers, etc. Specifically developed for backplane and daughter card designs where good signal integrity is essential. This material has excellent thermal properties.
- tec-speed 4.0 (Dk 3.8, Df 0.007) - Low-loss high-Tg material available with all copper styles, including HVLP. Applications focus on high-frequency and high-speed designs, Automotive and satellite communication, Navigation and GPS are typical applications. This material has excellent thermal properties.
- tec-speed 1.0 (Dk 3.9, Df 0.012 @ 10GHz RC75%) - Mid-loss mid-Tg halogen-free material available with all copper styles. Applications include hand-held products, specifically those that require high-frequency high-speed materials. This material has excellent thermal properties.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information about Ventec’s solutions and the company’s wide variety of products, please click here or download to the Ventec APP.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.