Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
Ventec to Focus on ‘tec-speed’ Brand for High Speed/Low Loss Materials at IPC APEX 2016
March 8, 2016 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, unveiled their high-speed/low-loss product portfolio, tec-speed, in January 2016. Ventec will be showcasing the range globally at a number of shows this year. Starting with IPC APEX EXPO in Las Vegas (15-17 March 2016), tec-speed will be a highlight at Ventec’s booth number 827 with an emphasis on the mil/aero applications.
Tec-speed unites Ventec's high-speed/low-loss product portfolio and better positions the range under a single identity, connecting the products through a clear and cohesive visual presentation. The tec-speed laminates and prepregs range from mid-loss (Df 0.012) to ultra-low-loss (Df 0.003) specifications with Dk levels ranging between 3.9 and 3.2, offering the ultimate in laminate technology and quality assurance through Ventec's proprietary manufacturing and distribution network.
Jack Pattie, president of Ventec USA, said, “Thermal performance and signal integrity demands are increasing, particularly for mil/aero applications where miniaturization and density of components are pushing the boundaries of PCB design. Tec-speed materials and our strategic roadmap of new innovative additions to the range, provide the technological innovation, high performance and quality demanded by our customers.”
A selection of products will be highlighted at the show, including:
- tec-speed 6.1 (Dk 3.2, Df 0.004 RC 50%) - Ultra-Low Loss High-Tg material available with all copper styles, including HVLP. Uses low Dk spread glass to improve skew and jitter. Applications include telecom, router, servers, etc. Specifically developed for backplane and daughter card designs where good signal integrity is essential. This material has excellent thermal properties.
- tec-speed 4.0 (Dk 3.8, Df 0.007) - Low-loss high-Tg material available with all copper styles, including HVLP. Applications focus on high-frequency and high-speed designs, Automotive and satellite communication, Navigation and GPS are typical applications. This material has excellent thermal properties.
- tec-speed 1.0 (Dk 3.9, Df 0.012 @ 10GHz RC75%) - Mid-loss mid-Tg halogen-free material available with all copper styles. Applications include hand-held products, specifically those that require high-frequency high-speed materials. This material has excellent thermal properties.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information about Ventec’s solutions and the company’s wide variety of products, please click here or download to the Ventec APP.
Share on:
Suggested Items
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
AT&S Sets New Standards in the Recycling of Copper and Chemicals
03/25/2025 | AT&SAT&S has been working for years to reduce the ecological footprint of its production sites worldwide with a comprehensive sustainability strategy and considerable investments.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.