-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Henkel Liqui-Form 3500 One-Part Gel a Breakthrough for Thermal Interface Materials
March 2, 2016 | HenkelEstimated reading time: 2 minutes
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Designed to provide a balance between dispensability, low component stress and reworkability, Liqui-Form 3500 delivers high conductivity of 3.5 W/m-K in a formulation that accommodates modern manufacturing environments. The viscosity of the material is exceptionally stable and is maintained during storage, processing and within the application.
“In many cases, Liqui-Form gels are an ideal replacement for traditional thermal interface pads,” explains Jerry Schmitz, Liqui-Form Product Line Manager. “With assemblies that have numerous small parts, manually placing multiple pads is cumbersome, labor-intensive and can introduce unnecessary mechanical stress during final assembly. In applications with high value boards requiring end-of-line rework, Liqui-Form 3500 is quickly removed with a wipe and a final clean. The inherently low adhesion stress minimizes risk of damage when disassembling the part, allowing manufacturers to preserve the integrity of the printed circuit board assembly.”
As Liqui-Form 3500 is pre-cured and has a higher viscosity than conventional thermal greases, it does not suffer from material migration – or “pump out” – over time, which contributes to its long-term reliability. In addition, the material has low volumetric expansion and stability in continuous use at temperatures as high as 200°C. Industry-leading low ionics is also a unique characteristic of Liqui-Form 3500, significantly reducing the threat of any potential electrical issues.
Liqui-Form products greatly simplify the procurement process and inventory management. The ability to source a single material as opposed to numerous thermal interface pads streamlines the BOM, saves time and lowers cost. Because these one-part formulations are fully cured, there is no mixing, refrigeration or post-curing required, allowing manufacturers to integrate Liqui-Form materials into their processes with high confidence.
“Liqui-Form 3500 is a win-win for electronics manufacturers,” notes Schmitz in summary. “Highly thermally conductive, compatible with automated dispensing processes for excellent throughput, easily reworkable and a single material solution, Liqui-Form 3500 addresses today’s demanding requirements – and then some!”
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas:
Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of $21.8 billion and adjusted operating profit of $3.4 billion in fiscal 2014. Henkel’s preferred shares are listed in the German stock index DAX.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Tight Upstream Supply and Restocking Drive 2024 DRAM Module Revenue Growth of 7%
09/30/2025 | TrendForceTrendForce reports that following the completion of inventory digestion in the downstream consumer market concluded at the end of Q4 2023, DRAM suppliers shifted focus towards HBM and server DDR5 products, leading to tighter supply for other DRAM types.
Looking to Reduce Your Consumables Spend? Visit ROCKA Solutions at SMTA International
09/29/2025 | ROCKA SolutionsROCKA Solutions, a trusted North American manufacturer and distributor of high-quality consumables for the electronics manufacturing industry, is pleased to announce its participation at SMTA International 2025, taking place October 19–23, 2025, at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees can connect with the ROCKA team at Booth #2413.
Nordson Electronics Solutions Enables Seamless Integration of Actnano PFAS-Free Coatings With Asymtek Select Coat Conformal Coating Systems
09/23/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.