-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
August 14, 2025 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
With nearly 25,000 systems installed at over 3,800 manufacturing sites, Koh Young set the standard in automated optical inspection for the electronics manufacturing industry. Building on that foundation, it expanded into semiconductor manufacturing with higher‑resolution optics, advanced measurement algorithms, and solutions engineered for metrology and inspection of wafer‑level packages (WLP), system‑in‑package (SiP), and ultra high-density interconnect applications.
As an exhibitor, Koh Young will highlight how its AI‑powered metrology and inspection solutions can help manufacturers meet the exacting demands of advanced packaging and semiconductor processes. From wafer‑level to SiP, Koh Young technology delivers accurate, repeatable data to enable smarter process control, higher yields, and supports zero‑defect production goals.
Dimensional Metrology for Advanced Packaging
Koh Young’s Meister Series is purpose‑built for advanced packaging, including SiP, WLP, and die stacking metrology. These systems provide ultra‑high‑resolution 2D/3D measurement to manage features and tolerances in next‑generation designs. Complementing the Meister Series, the ZenStar delivers wafer‑level dimensional metrology to detect and quantify critical parameters at the earliest stage, ensuring only known‑good components advance. Together, these platforms help manufacturers maintain process windows, improve yield, and reduce costly rework.
As India accelerates its Make in India semiconductor mission, Koh Young is committed to supporting local and multinational manufacturers in building a competitive, self‑reliant ecosystem for advanced electronics. By delivering robust, data‑driven metrology and inspection, Koh Young enables domestic production that meets the stringent standards of global supply chains.
“India’s semiconductor industry is entering an unprecedented growth phase,” said Peter Shin, General Manager, Koh Young South‑East Asia. “Our advanced dimensional metrology and inspection solutions empower manufacturers to deliver world‑class quality, improve productivity, and strengthen India’s position in the global semiconductor market.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Nordson Test & Inspection Partners with Quiptech Mexico to Expand Market Presence
05/05/2026 | Nordson Test & InspectionNordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, announced a strategic partnership with Quiptech Mexico (a trading name of QTEK Mexico).
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
TRI Highlights Advanced SEMI Inspection and Metrology Solutions at SEMICON SEA 2026
03/25/2026 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at MITEC, Kuala Lumpur, Malaysia from May 5 - 7, 2026.Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at MITEC, Kuala Lumpur, Malaysia from May 5 - 7, 2026.
Siemens Acquires Canopus AI to Bring AI-based Metrology to Semiconductor Manufacturing
02/04/2026 | SiemensSiemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.
GenI Generative AOI Programming Debuts: Mycronic Sets a New Standard in AOI Automation
11/10/2025 | MycronicMycronic’s PCB Assembly Solution division announces the launch of GenI™, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection (AOI) programming.