Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Matrix to Display Full Line of Flexible Circuit Materials at IPC
March 3, 2016 | MatrixEstimated reading time: 1 minute
Matrix USA will be exhibiting its full line of advanced materials to support the flexible circuit market in North America.
Key products include:
PANASONIC FELIOS – Advanced adhesiveless copper clad flex materials designed to meet the demanding high performance and reliability requirements for avionic, commercial, industrial and consumer markets. Panasonic offers the largest selection of both thin and thick copper foil and polyimide film constructions in the market. Product offered in panels and rolls.
MATRIX PLUS AND PLUS FR – Full line of cover lay, bond-ply, and bond adhesives to enhance the performance of single and double sided, multilayer and rigid-flex circuit designs. Made in USA.
SANTA CLARA FLEX CONVERSION CENTER – Completed in 2015 this new flex conversion center offers quick turn conversion of roll flexible circuit materials to custom panel sizes specializing in long panel sizes such a 24” x 60”. This is supported by the region’s largest inventory of standard and specialty flex materials.
Matrix and Panasonic personnel will be available at the IPC/APEX Show in Las Vegas, March 15-17, Booth 247 to discuss the features, benefits, and advantages of these flex materials and the full line Matrix supplied materials and services.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has four rapid response warehouses located throughout the US and Canada that fulfil high quality, fast delivery, and custom orders daily.
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.