Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
ELEXCON 2016 to Highlight Electronic Components, Material and Assembly Technology Developments
March 4, 2016 | ELEXCON 2016Estimated reading time: 1 minute
When design engineers, purchasing professionals and policy makers gather at this year’s ELEXCON, one of China's largest and most important electronic exhibitions, a wide range of topics critical to the continuing progress of the industry will be featured:
- Start-ups: hardware, software and the supply chain—a focus on entrepreneurial trends accelerating industrial reshuffling
- Cross innovation: automotive, industrial & medical electronics—unbounded innovation generating endless cross-market opportunities
- One-stop: a one-stop exchange—purchase platforms for components, modules and system integration
Looking ahead, innovation, entrepreneurship and inter-industry integration will be a central focus at ELEXCON 2016, which will be held from August 24–26, 2016 at the Shenzhen Convention & Exhibition Center.
- IPC & Embedded Expo
- Southern China Automotive Electronics Summit
- MCU! MCU!
- China International Medical Electronics Tech (CMET)
- IOT Technology and Application Conference
- China Mobile Manufacture Forum (CMMF)
"ELEXCON is one of the most popular exhibitions in China with an emphasis on electronic components, materials and assembly. It is an excellent platform for global IC, electronic component, module, electronic material, and electronic manufacturing equipment enterprises. More than 500 international companies exhibit to promote their brands, launch new products and technologies, and conduct business exchanges in the Chinese market. It is also a one-stop industrial exchange platform on which electronics manufacturing industry professionals, buyers, media and decision-makers collect information concerning suppliers, technologies and markets and explore industrial development directions," said Jesse Zhao, vice president of Creativity Convention & Exhibition, the organizer of ELEXCON 2016.
For more information on the event, click here.
Share on:
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
IPC-CFX, 2.0: How to Use the QPL Effectively
07/02/2025 | Chris Jorgensen, Global Electronics AssociationIn part one of this series, we discussed the new features in CFX Version 2.0 and their implications for improved inter-machine communication. But what about bringing this new functionality to the shop floor? The IPC-CFX-2591 QPL is a powerful technical resource for manufacturers seeking CFX-enabled equipment. The Qualified Product List (QPL) helps streamline equipment selection by listing models verified for CFX compliance through a robust third-party virtual qualification process.
Advancing Aerospace Excellence: Emerald’s Medford Team Earns Space Addendum Certification
06/30/2025 | Emerald TechnologiesWe’re thrilled to announce a major achievement from our Medford, Oregon facility. Andy Abrigo has officially earned her credentials as a Certified IPC Trainer (CIT) under the IPC J-STD-001 Space Addendum, the leading industry standard for space and military-grade electronics manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.